The CIA is going to love this one. We call it “Spy Fly.” The application is related in general to micromechanical flying insect (MFI) devices. More specifically, embodiments of the present invention provide a drive assembly for a wing of a MFI. Embodiments of the present invention also provide a drive assembly for a wing of a micromechanical flying insect. The drive assembly includes a honey comb structure, and an actuator including a piezoelectric material and a bonding layer. The actuator comprises a single crystal piezoelectric or an amorphous piezoelectric layer. The invention further provide a method for flying a micromechanical flying insect comprising moving a wing with a drive assembly having a stiffness to weight ratio greater than about 16.times.10.sup.10 N/mKg. The drive assembly comprises a honeycomb structure. This type of assembly overcomes drawbacks of using conventional stainless steel beams which have high inertias and are difficult to construct. This report is available to clients without cost.
Background information on some of the basic technology addressed or referred to in this application is available from Wikipedia.
PatentFox Report No.: 6280
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